We control heat at the source.

APR’s precision cooling technology targets heat directly where it is generated, and only where it is generated. Superior cooling, higher system performance, less energy consumed.

System lifetime
0 + years
Energy costs down
20- %
Usable computing area up
0 %

Fluid that moves without a pump. Cooling that responds the instant a hotspot appears.
A ceramic device with no moving parts that outlasts the system around it.

Fluid that moves without a pump. Cooling that responds the instant a hotspot appears.
A ceramic device with no moving parts that outlasts the system around it.

Say hello to Rheion™

01

Efficient

Cools only where heat is generated. No energy wasted.
02

Scalable

One architecture. From a single chip to megawatt scale.

03

Durable

No moving parts. Up to 20 years design lifetime.
04

Safe

Non-conductive, fire-proof dielectric fluid. Sealed.
05

Compact

No bulky cooling infrastructure. Double the computing area.

AI, power electronics and high-density compute are driving heat flux levels beyond what conventional cooling can manage.

That is why we don’t do conventional.

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Applications.

Data centers

Cooling control on chip-level, enabling higher performance at lower temperatures, reduced energy consumption and improved PUE. 

Space & Defense

Thermal management with no moving parts, eliminating wear-out mechanisms and failure points. 

Telecom

Compact, highly reliable and energy-efficient thermal management adapted for always-on operations. 

Batteries

Thermal management that enables higher power density design without compromising efficiency, reliability and lifetime. 

Power Electronics

Precise temperature control across cells prevents thermal runaway, creating safer batteries with improved performance. 

70+ patents

Collaborations with ESA, NASA and Airbus

Selected for NATO’s DIANA programme  

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